FACILITY

FACILITY

FACILITY
 Screen Printer    Pick & Place  Reflow
 DEK249  Mydata – MY9  Yamaha – YS12  SMR400
 PCB Dimension (in mm)  450 X 450  384 X 508  385 X 480  457 X 610
 CPH  14400 (rated)  30000 (rated)
 Component size (Min.)   0201 Capability exists for 01005  01005
 Component size (Max.)  56mm X 56mm  Within 8 mm tape
 PCB Finish  ENIG, HAL, Ag, Leadfree HAL & NTEK
 Process  Leaded & Lead free
 BGA  Yes  NO
 LGA  Yes  NO
 PLCC / QFN  Yes  NO
 Component Height (in mm)  15  15
 Standard solder types used  Type 3 & Type 5
 Odd Size component  1 or 2 varieties can be handled
Machine Assembly
  • State of the art flexible manufacturing facility
  • Major Machinery specifications provided in Machinery Section
  • Cyber Optics Laser section Microscope for solder paste measurement
  • Wave Soldering
  • EPS SWSM300D, 12” (RoHS/Pb-free)
  • Semi automatic, axial lead forming machine
  • Manual stuffing line
  • Manual Assembly / Press Fit
  • Point Ezee software for manual assembly (Internally developed software)
  • Weller and Hakko soldering stations (non-RoHS)
  • OKI soldering stations (RoHS)
  • Press Fit assembly
  • Rework
  • Air-VAC rework station suitable for BGA removal, attachment
  • Seirra SRT rework station
  • BGA ball replacements
  • Inspection
  • Visual Inspection assisted by Scan to Inspect Software (Internally developed software)
  • RTX-113 X Ray inspection system
  • Zoom microscopes (*45)
  • Magnifying glasses (*4)
  • Test Equipments
  • Custom Test Jigs
  • PC as Test Platform
  • Bench Power Supply
  • Enviroinmental Testing Chamber
  • Oscilloscopes
  • Multimeters
  • QUALITY PLAN