Author: admindev

Categories
blog

Best Practices for PCB Panel Design in Manufacturing and Assembly

Best Practices for PCB Panel Design in Manufacturing and Assembly

In the world of electronics manufacturing, efficiency and precision are paramount. PCB panelization—the process of combining multiple smaller printed circuit boards (PCBs) into a single, larger array—is a crucial technique used to streamline the assembly process. This article outlines the best practices for PCB panel design, focusing on dimensions, handling requirements, and essential panel features.

1. The Importance of a Well-Designed Panel Structure

  • If a PCB is not panelised for a pick-and-place machine, assembly becomes inefficient and error-prone because the machine relies on standardized panel dimensions and fiducials for accurate positioning. Irregular-shaped boards, very small PCBs, components appearing in the edges of the PCB are especially problematic, as they cannot be properly clamped or conveyed, leading to misalignment, poor placement accuracy, and increased risk of component loss or damage. This often results in slower throughput, more manual handling, higher defect rates, and increased manufacturing cost.

Fig.1 : Examples of an irregularly shaped PCB, Too small size and Components appearing in edges.

  • Machine Compatibility: The panel must fit within the minimum and maximum dimension constraints of the assembly line equipment (e.g., solder paste printers, pick-and-place machines, reflow ovens). A typical minimum size is around 50mm x 50mm, while maximums can reach 330mm x 530mm or more.

  • Panel Borders (Edge Rails): A crucial element of any panel is the handling edge or border. This is a component-free zone around the perimeter of the panel that allows automated machines to transport and clamp the board during processing.

The image below illustrates a typical PCB panel layout with a 2×3 array of boards, clearly showing the surrounding handling edge.

Rectangle 6
Figure 2: A complete PCB panel showing a 2×3 array of boards. Note the solid, component-free border around the perimeter, which serves as the crucial handling edge.

2. Common types of PCB panelization include:

  1. Tab Routing (Tab + Mouse Bites)  – Individual boards are held together by small tabs with perforated holes; boards are snapped apart after assembly. Consider tab routing when your design has an irregular shape or if you need space between your boards to allow for overhanging components. Default is to add a 0.1″ (2.0mm) gap between the boards to allow the router bit to pass between them. Small tabs of material will remain to hold the boards in place. To make separation easier, add small non-plated holes to the tabs called ‘mouse bites’ to perforate the tab. The breakaway tab closest to the PCB corner should be located between 10 mm and 12 mm from the edge to reduce sagging during reflow or wave soldering. It is also preferred to have at least one tab per side. If the PCB placement is too dense for a Tooling Hole, then it should be placed on the breakaway tab. See Figure 3 for the optimized breakaway tab solution.

Fig3

One important aspect is to have a clean edge after the breakaway tab is removed. Slight inset of perforation is preferred because it provides an edge which requires little to no additional labor to clean up. Figure 2 illustrates the perforation location preferences.

Fig4

  1. V-Groove (V-Scoring) – This method involves cutting a V-shaped groove into both the top and bottom surfaces of the panel, leaving a thin web of material connecting the boards, allowing clean separation by snapping; best for straight-edge designs.

Fig5 Fig6

  1. Solid Routing – Boards are fully routed with no breakaway until final depaneling using a router; used for complex or sensitive boards.

  2. Frame Panelization – Multiple boards are placed inside a rigid outer frame, improving handling for small or irregular-shaped PCBs.

  3. Mixed Panelization – Combination of V-groove and tab routing in a single panel, depending on board geometry.

  4. Array Panelization – Identical PCBs arranged in rows and columns to maximize panel utilization and assembly efficiency.

2. Critical Handling Area and Essential Features

The panel’s edge rails are not just empty space; they are critical for the successful operation of pick-and-place and screen printing machines.

  • Conveyor Transport: Most SMT (Surface Mount Technology) machines use edge conveyors to transport panels down the line. The conveyor belts or clamps grip the panel by its edges. A clear, flat area is essential to ensure a secure grip and prevent damage to components.

  • Recommended Dimensions: A minimum border width of 3mm to 5mm is typically required on at least two parallel sides for conveyor transport.

  • Component Keep-Out Zone: No components should be placed within this handling area. A general rule is to keep components at least 3mm to 5mm away from the panel edge to avoid interference with conveyor clamps and to prevent damage during depaneling.

The handling edge is also the designated location for essential manufacturing features:

  • Fiducial Markers: These are precise copper circles that act as reference points for the machine vision systems of pick-and-place machines. They ensure accurate alignment of the panel and individual boards.

    • Size & Placement: Typically 1.0mm to 3.0mm in diameter. A minimum of three global fiducials should be placed in the corners of the panel border for overall alignment.

    • Clearance: A clear, solder-mask-free area with a radius of at least twice the fiducial’s diameter must surround each marker.

  • Tooling Holes: These unplated holes, usually located in the corners of the panel border, are used to physically secure and align the panel during processes like stencil printing and drilling.

Rectangle 5

Conclusion

Adhering to these PCB panel design best practices is a critical step in ensuring a smooth and cost-effective manufacturing process. By correctly dimensioning the panel, providing a dedicated handling edge for automated equipment, and incorporating essential features like fiducials and tooling holes, designers can significantly reduce the risk of assembly errors and product defects.

Author: Rahul N M

Mr. Rahul is a Process Engineering and Planning Engineer at Peninsula Electronics, bringing strong technical expertise to support key technical functions and processes.

Categories
blog

A Deep Dive into Production-Ready Bill of Materials – Part 3

Peninsula Electronics • BOM Series
 

The "Dirty Dozen": Critical BOM Mistakes to Avoid

Based on thousands of projects, Peninsula Electronics has identified recurring BOM errors that invariably lead to costly delays. Let’s transform these mistakes into lessons.

Mistake 1: Part Number and Description Conflict (The "Trust but Verify" Failure)

The Error: MPN says LM1117-3.3 (3.3V Regulator), but Description says LDO Regulator, 5V.

The Consequence: Procurement might order based on description, delivering the wrong voltage rail to your board.

The Fix: Meticulous cross-verification. Ensure the MPN dictates the description.

Mistake 2: Insufficient Voltage or Power Rating (The "Time Bomb")

The Error: Using a 10V rated capacitor on a 25V line, or a 0.1W resistor where 0.5W dissipation is needed.

The Consequence: Components operate outside their Safe Operating Area (SOA), leading to premature field failures and warranty claims.

The Fix: Always derate components. A 25V line typically needs a 50V capacitor.

Mistake 3: Ignoring Environmental Grade (The "Environmental Flop")

The Error: Using commercial grade parts in industrial, automotive, or aerospace environments.

The Consequence: Premature failure under temperature, vibration, or humidity stress.

The Fix: Specify part grades (Industrial, Automotive AEC-Q, etc.) explicitly in your BOM.

Mistake 4: Missing DNP (Do Not Populate) Clarity

The Error: Parts present in the BOM but unmounted on the board are not clearly labeled as DNP with procurement instructions.

The Consequence: Unnecessary buying and confusion during assembly.

The Fix: Use a dedicated “Mount Status” column and clearly label DNP.

Mistake 5: No Approved Alternates (Single-point Failure)

The Error: Only one MPN listed for a critical part.

The Consequence: Sourcing delays during shortages or allocations.

The Fix: Add validated alternates and document any footprint or spec caveats.

Mistake 6: Incomplete Mechanical Hardware

Many BOMs omit screws, standoffs, nuts, and mounting hardware.

The Consequence: Production halts for “small parts.”

The Fix: Treat mechanical hardware with the same rigor as electronics.

Mistake 7: Forgetting Consumables

Adhesives, thermal paste, solder wire, cleaning fluids, etc. are frequently missed.

The Consequence: Line stops while someone scrambles to source them.

The Fix: Include consumables, quantities, and units.

Mistake 8: Incorrect Quantity Per Assembly

The Error: Listing total quantity (for a batch) instead of per-PCB usage.

The Consequence: Wrong procurement volumes, quote errors.

The Fix: Always specify Qty Per Assembly, and keep batch totals separate.

Mistake 9: Using Generic Descriptions Instead of Specs

The Error: “Resistor 10k” instead of full tolerance/power/package.

The Consequence: Procurement substitutes incorrectly.

The Fix: Use concise but complete specifications.

Mistake 10: Not Tracking Revision History

The Error: Sending “final_bom.xlsx” repeatedly with changes.

The Consequence: Confusion and wrong builds.

The Fix: Use version-controlled naming and a revision log.

Mistake 11: Missing Lifecycle / EOL Checks

The Error: Using NRND/EOL parts unknowingly.

The Consequence: Redesigns late in the cycle.

The Fix: Run lifecycle scans via tools like Octopart/SiliconExpert.

Mistake 12: No Approved Vendor List (AVL) Control

The Error: Procurement “auto-subs” alternates without engineering approval.

The Consequence: Inconsistent performance and quality.

The Fix: Own and control your AVL.

Final Thoughts: Beyond Documentation, Towards Discipline

It is a common misconception that supply chain issues are purely external. In our extensive experience at Peninsula Electronics, the vast majority of delays originate from incomplete or ambiguous Bills of Materials.

A technically robust BOM is not merely a document; it is a testament to engineering discipline. By adhering to these standards, you do not just create a list of parts—you create a path to success.

Ready to bring your product to life with precision and expertise? Contact Peninsula Electronics today.

Author: Vivek

Mr. Vivek is an Assistant Manager at Peninsula Electronics, with a strong focus on execution and coordination

Categories
blog

A Deep Dive into Production-Ready Bill of Materials – Part 2

Peninsula Electronics • BOM Series

Designing BOMs for Real‑World Builds

Introduction: A BOM Must Survive the Supply Chain

Real builds don’t happen in an ideal market. Lead times shift, allocations appear, and a part that was
easy to buy last month may be unavailable today. A robust BOM is designed for these realities: it allows
procurement to react quickly while still staying inside engineering-approved boundaries.

Multi‑Sourcing: Stability Without Losing Control

Single-source dependencies are a common cause of schedule slips. When a critical part becomes scarce,
teams scramble for substitutes and performance can drift quietly. The better approach is to pre-approve
alternates and document what must match.

Best practice: Define a preferred part and a small set of validated alternates—each with notes on constraints.
Line item Preferred (Primary) Approved alternate(s) Engineering notes
3.3V LDO Regulator Texas Instruments – TLV1117-33DCYR Diodes Inc. – AZ1117CH-3.3TRG1
Advanced Monolithic Systems – AMS1117-3.3		 Pin-compatible; verify dropout and thermal limits for high-load designs
DC Barrel Jack CUI Devices – PJ-102A Kycon – KLDX-0202-A
Tensility – 54-00166		 Confirm mechanical footprint and current rating
10µF MLCC (0603) Murata – GRM188R60J106KAAL Samsung – CL10A106KP8NNNC
TDK – C1608X5R0J106K080AC		 DC-bias loss differs by vendor; X5R mandatory

This gives procurement flexibility without turning substitutions into uncontrolled experiments.

Beyond Electronics: Hardware and Consumables That Still Stop Builds

Many production delays are caused by items that are not “electronics” at all—screws, standoffs, labels,
thermal pads, adhesives, wire, or cleaning supplies. If assembly needs it to finish the product, it belongs
on the BOM (or the controlled build pack) with clear specifications and quantities.

Mechanical hardware

  • Specify size, length, head type, material, finish, and quantity per assembly.
  • Prefer an MPN or a controlled internal part number for traceability.

Consumables

  • Include solder/flux, thermal compound, epoxy, tape, wire, cleaning chemicals, etc.
  • Use explicit units (grams, ml, meters) and add handling notes when relevant.
Quick test: If a technician must request it mid-build, it was missed in the BOM.

Structure matters because it reduces friction across quoting, ordering, receiving inspection, and assembly.
The following columns keep a BOM both human-checkable and machine-actionable.

Column What it should contain Why it matters
Ref Des R1, C12, U5… Traceability to schematic/PCB
Manufacturer Exact manufacturer name Controls sourcing variation
MPN Full part number Locks the exact variant
Description Short specs (value/package/tolerance/grade) Fast sanity check
Package 0805, QFN‑32… Prevents fit errors
Qty per assembly Per PCB / per unit Avoids ordering confusion
Mount status Mounted / DNP Prevents accidental population
Alternates Approved alternates + notes Resilience during shortages
Notes Special instructions Manufacturing clarity

Pre‑release checklist

  • Lifecycle check: flag NRND/EOL risks before you freeze the BOM.
  • Consistency check: manufacturer + MPN + description must agree on every line.
  • DNP discipline: mark DNP clearly and define ordering rules.
  • Alternate governance: verify footprint + grade + limits; document exceptions.
  • Revision control: version the BOM and keep a short change log.
Release mindset: If a decision is “left to interpretation,” it will be made downstream—without context.

File Naming & Revision History (Release Discipline)

File hygiene is part of BOM quality. A clean naming convention and a visible revision history prevent teams from
ordering or building from the wrong version.

Version-controlled filename (real example)

Standard: [ProjectName]_[Revision]_[YYMMDD].xlsx
Example: AlphaSensor_RevB-2_231025.xlsx

Revision History on Sheet 1 (real example)

Date Revision Change Why
2023-10-25 RevB-2 Line 14: MPN updated to Samsung CL10A106KP8NNNC (10µF 0603 X5R) Primary part lead time increased; alternate qualified during design
2023-10-25 RevB-2 Line 22: Added approved alternate LDO AZ1117CH-3.3TRG1 Pin-compatible; verified thermal margins for target load

… Continued in Part 3

Author: Vivek

Mr. Vivek is an Assistant Manager at Peninsula Electronics, with a strong focus on execution and coordination

Categories
blog

A Deep Dive into Production-Ready Bill of Materials – Part 1

Peninsula Electronics • BOM Series

Foundations of a Production‑Ready BOM

 

Peninsula Electronics: “At Peninsula Electronics, we don’t just ‘buy parts’—we partner with you to ensure every line item is a calculated step toward manufacturing excellence.”

Introduction: The BOM Is a Build Instruction, Not a Shopping List

A Bill of Materials (BOM) is the handoff document that connects design intent to real manufacturing.
When it is precise, buyers source the correct parts quickly, assembly runs without pauses, and QA can
verify compliance with confidence. When it is vague, every missing detail becomes a costly question—often
asked when timelines are already tight.

Practical rule: A production-ready BOM eliminates ambiguity before any purchase order is raised.
  • Production-ready BOMs
  • Sourcing clarity
  • Manufacturing excellence

1) What Defines a Production‑Ready BOM?

A BOM is production-ready when each line item can be sourced and inspected without interpretation.
That means it clearly states the approved manufacturer, the exact part variant, the quantity per assembly,
and whether alternates are allowed (and which ones).

  • Procurement orders confidently—no guessing.
  • Manufacturing builds continuously—fewer holds.
  • QA verifies quickly—clear acceptance criteria.
  • Engineering keeps control—no silent substitutions.
Peninsula expectation: Every critical attribute is either stated explicitly or locked by the MPN.

2) Complete Manufacturer Part Numbers (MPNs): The Non‑Negotiable Core

“10µF capacitor” and “10k resistor” describe categories, not specific parts. Components that look similar on paper
can behave very differently depending on dielectric, voltage rating, tolerance, footprint, and performance under bias.
The most reliable way to prevent drift between design and sourcing is to tie each BOM line to a complete MPN and manufacturer.

Example: Three “10µF” Capacitors That Do Not Perform the Same

AttributeOption AOption BOption C
Nominal value10µF10µF10µF
DielectricY5V (higher drift)X5R (moderate)X7R (stable)
Voltage rating6.3V16V25V
Package060308051206
Bias performanceHigher lossMedium lossLower loss
Temperature rangeNarrowerStandardWider

❌ Ambiguous

C12 — 10µF capacitor — Qty 1

Too many open choices: the sourced part may be “close enough” but not equivalent (dielectric, voltage, package, DC-bias behavior).

✅ Controlled

Ref Des: C12

Manufacturer: Murata

MPN: GRM21BR61C106KE15L

Desc: CAP CER 10UF 16V X5R 0805

Qty: 1

Remarks: XXXX

You don’t need long descriptions, but you do need the correct identity. A complete MPN reduces procurement back‑and‑forth,
prevents wrong substitutions, and makes scaling from prototype to production far more predictable.

3)The “AMS1117 Paradox”: Why MPNs Need Manufacturers

“Precision is the soul of manufactured excellence.”

A common and insidious issue in electronics BOMs is the use of a seemingly “generic” part number
that is actually supplied by multiple manufacturers. When the BOM lists only the part number—without
naming the manufacturer—it creates immediate ordering ambiguity and silently transfers engineering
decisions to procurement.

Peninsula Insight: The AMS1117‑3.3 Case Study

Same part number ≠ same part. Although many vendors sell devices labeled
AMS1117‑3.3, these parts are not electrically identical.

Key differences commonly observed

  • Thermal performance (θJA, θJC)
  • Dropout voltage
  • Maximum output current
  • Quiescent current
  • Line and load regulation
  • Output noise
  • Reliability grade (commercial vs industrial vs automotive)
Design reality: Treating all AMS1117‑3.3 parts as interchangeable is a design risk, not a convenience.

🚫 Risky BOM Entry (Ambiguous)

Manufacturer: —

Part Number: AMS1117‑3.3

This forces procurement to select a vendor based on price or availability—without engineering approval—
introducing unpredictable electrical and reliability risks.

✅ Correct BOM Entry (Controlled)

ManufacturerPart NumberRemarks
Diodes Inc.AMS1117‑3.3Preferred, thermally validated
Advanced Monolithic SystemsAMS1117‑3.3Approved alternate
Unisonic TechnologiesAMS1117‑3.3Approved alternate, cost‑effective

Benefits

  • Controlled sourcing
  • Consistent electrical behavior
  • Predictable production quality

Why “Any Make Acceptable” Is Dangerous

BOM line: AMS1117‑3.3 – Any make acceptable

  • Electrical tolerances vary by vendor
  • Qualification levels differ
  • Long‑term reliability is inconsistent
  • Failure root‑cause analysis becomes nearly impossible
Peninsula rule: “Any make” is allowed only after each manufacturer is validated and approved. Otherwise, it simply means any problem.

Same Value, Same Package, Different Results

Even passive components show the same behavior. Consider a
0.1µF, 0603, X7R MLCC. Parts that look identical on paper
often differ significantly by manufacturer.

  • DC bias capacitance loss
  • Aging characteristics
  • ESR and ESL behavior
  • Temperature stability
  • Mechanical robustness (crack resistance)

Without defined preferred manufacturers and approved alternates, mixed sourcing leads to inconsistent
noise filtering and unstable power integrity across builds.

Same Number, Different Story: The Multi‑Make Myth

  • Look beyond the label: Same MPN ≠ same performance.
  • Trust, then verify: Qualify alternates during design—not during a shortage crisis.
  • Own the AVL: Control your Approved Vendor List to prevent unauthorized substitutions.
Bottom line: A good BOM removes ambiguity. A bad BOM transfers engineering decisions incorrectly to procurement—and that’s where problems begin.

… Continued in Part 2

Author: Vivek

Mr. Vivek is an Assistant Manager at Peninsula Electronics, with a strong focus on execution and coordination

Categories
INFRASTRUCTURE

ISO 13485:2016

Categories
blog

Understanding First Pass Yield: The Math Behind Quality Excellence

Understanding First Pass Yield: The Math Behind Quality Excellence

In electronics manufacturing, First Pass Yield (FPY) is one of the most critical metrics for measuring production quality. It tells us the percentage of products that pass through the manufacturing process without any defects on the first attempt—no rework, no repairs, just perfect execution. But how do we predict FPY, and more importantly, how do we work backwards from our yield goals to set defect targets? Let’s dive into the mathematics that makes this possible.

The Foundation: Understanding Defect Opportunities

Every assembly we build presents multiple opportunities for something to go wrong. A typical PCB assembly might have 400 components to place and 1,600 solder joints to form—each one is an opportunity for a defect. The fundamental insight is this: if we know the defect rate per opportunity and the number of opportunities, we can predict our overall yield.

The Core Formula: Calculating First Pass Yield

The probability that a single opportunity has no defect is:

P(no defect) = 1 – DPO

where DPO (Defects Per Opportunity) is typically expressed in ppm (parts per million).

For an assembly with n opportunities, all must be defect-free for the unit to pass:

FPY = (1 – DPO)n

Since DPO is usually very small (measured in ppm), we can also use the Poisson approximation:

FPY = e(-n × DPO)

Practical Example

Let’s say we have an assembly with:

  • 400 components to place
  • 1,600 solder joints to form
  • Total opportunities = 400 + 1,600 = 2,000 opportunities
  • Target defect rate: 100 ppm

Converting ppm to decimal: DPO = 100/1,000,000 = 0.0001

Using the exact formula:
FPY = (1 – 0.0001)2000 = (0.9999)2000 = 0.8187 = 81.87%

Using the Poisson approximation:
FPY = e(-2000 × 0.0001) = e(-0.2) = 0.8187 = 81.87%

Both methods give us the same answer: approximately 82% of our assemblies will pass on the first attempt with a 100 ppm defect rate.

The Reverse Calculation: From Yield Goals to PPM Targets

Now here’s where it gets really useful for manufacturing planning. If management says “we need 95% FPY,” what defect level do we need to achieve?

Starting with our FPY formula:

FPY = (1 – DPO)n

We solve for DPO:

DPO = 1 – FPY(1/n)

Or using the Poisson form:

DPO = -ln(FPY) / n

Working Example

Target: 95% FPY for our 2,000-opportunity assembly (400 components + 1,600 joints)

Using the exact formula:
DPO = 1 – (0.95)(1/2000) = 1 – 0.9999744 = 0.0000256 = 25.6 ppm

Using the Poisson approximation:
DPO = -ln(0.95) / 2000 = 0.0513 / 2000 = 0.0000256 = 25.6 ppm

This tells us we need to maintain a defect rate below 26 ppm to achieve our 95% FPY target.

The Critical Insight: Complexity Kills Yield

Here’s what the math reveals that many manufacturers learn the hard way: yield drops exponentially with complexity.

Consider three scenarios with the same 100 ppm defect rate:

  • Simple assembly (500 opportunities): FPY = 95.1%
  • Medium assembly (2,000 opportunities): FPY = 81.9%
  • Complex assembly (5,000 opportunities): FPY = 60.7%

Same defect rate, dramatically different yields! This is why high-mix electronics manufacturers must obsess over driving defect rates down—complexity is unforgiving.

Quick Reference Formulas

Calculate FPY from known defect rate:
FPY = (1 – ppm/1,000,000)n
or
FPY = e(-n × ppm/1,000,000)
Calculate required PPM from target FPY:
ppm = [1 – FPY(1/n)] × 1,000,000
or
ppm = [-ln(FPY) / n] × 1,000,000

where n = number of defect opportunities per unit (components + solder joints)

Putting It Into Practice

These formulas aren’t just academic exercises—they’re essential planning tools. When quoting a new project, you can estimate realistic yields. When setting quality targets, you know exactly what defect levels your team needs to achieve. And when yields fall short, you can quickly calculate how much improvement is needed.

The beauty of this mathematical framework is that it transforms vague quality goals into concrete, measurable targets. Instead of saying “we need better quality,” you can say “we need to reduce our defect rate from 200 ppm to 100 ppm to hit our yield target.” That’s actionable.

Remember: in manufacturing, what gets measured gets managed, and what gets calculated gets achieved.

Our Quality Commitment

At Peninsula Electronics, quality isn’t just a goal—it’s our standard. We assure our customers that when assemblies are supplied without functional testing, our residual defect rates will be maintained at approximately 100 ppm or better. This commitment means that for a typical 2,000-opportunity assembly, you can expect First Pass Yields exceeding 81%, giving you the reliability and consistency your products demand.

Author: Parthasarathy.S

Mr. Parthasarathy is the General Manager at Peninsula Electronics. He brings extensive experience in the electronics industry.

Categories
Uncategorized

Quality

smt manufacturing
  • ISO 9001 cerified
  • Customer Oriented Culture
  • Quality Levels
    • We commit 250 PPM for any board produced by us.
    • Any design related manufacturing issue will be identified and risk communicated to Customer.
    • In practice, we achieve 50-100 PPM or less for boards without manufacturing issues.
    • Production runs characterized by repeat runs at frequent intervals, 50- 60 PPM achieved.
    • If functional testing is done by us, 100% defect free boards will be supplied.
    Categories
    Uncategorized

    Design Support

    SMT PCB assembly
    • Preparation Of Schematics using ORCAD capture tool
    • PCB design and Cadding, incorporating DFM guidelines, using Cadence Allegro version 15.7 & version 16.0
    • Mechanical enclosure design with Pro Engineer
    • Close working relationship with PCB & Prototype Box vendors
    • Technical Support in finalizing BoM, looking at Availability, Costs, Alternates
    • Participation in Testing & debugging of boards, including help in identifying design problems, if any.
    Categories
    Uncategorized

    Supply Chain Management

    conformal coating pcb
  • Verification of Manufacturer part number
  • Alternate suggestions in cases of Cost or Availability issues
  • Procurement of Electronic / Mechanical / Plastic moulded items
  • Specialized for low and medium volumes

    • Access to all online vendors for electronic items (Digikey / Mouser / Newark / Element14 / Farnell)
    • Distributors and Manufacturer Representatives (Future / Arrow / Avnet)
    • Close working relationship with PCB vendors for both Proto and Volume (India / China)
    • Qualified general Traders in UK & USA for difficult to source / Obsolete components
    • Close working relationship with qualified local Manufacturers (Crystals, Discretes).
  • Regular review of Materials Status to ensure near simultaneous availability of 100% of the items.
  • Customs Clearance, Warehousing, Stock reports of Customer supplied items
  • Exemption from duties and Taxes for imports meant for Exports.
  • Logistics support for fast customs clearance of imports & Exports
  • Monitoring export shipment transit status till delivery is made to Customer
  • Regular communication with Customer on Status, Issues and possible solutions, delivery time etc.
    • Categories
    INFRASTRUCTURE

    EN9100:2018

    Subscribe
    Our Newsletter

    Peninsula Electronics logo

    QUICK LINKS

    CONTACT INFO

    ADDRESS
    V-2-C NGEF Industrial Estate
    Graphite India Road
    Bangalore 560048 INDIA

    EMAIL mktg@peninsulaelectronics.com

    Facebook Instagram Twitter Whatsapp

    © All Copy Rights Reserved PENINSULA ELECTRONICS 2026.

    Terms & Conditions | Privacy Policy